Specifications of our products:
Cepol-S
Cepol-S is designed for the precision
polishing of optical components. It finds application in the polishing of telescope lenses, TV camera lenses and other applications
where the highest precision and surface quality are required.
The powder can also be used for the
polishing of semiconductor wafers and other electronic components and a special grade with a particle size of less than 0.5
microns is available to special order where sub-micron precision is required.
D50: 1
micron
Cerium content: Ce
O2 100%
Colour: white
Polishing efficiency: 30-60
mg/min/dm2
Recommended polishing lap: Polyurethane
Recommended polishing speed: not less than 500 rpm
No suspension agents are added so agitation of the slurry is recommended. Suspension
agents can be recommended for particular applications.
Cepol-P
This powder is designed for optical components, ophthalmic lenses and camera lenses. The surface
quality is exceptional for this type of powder. Because of the very high cerium content, polishing efficiency is very high
and the small particle size ensures exceptional surface quality.
D50: 2
microns
Cerium content: Ce
O2 80%
Colour: light
pink
Polishing efficiency: 30-80
mg/min/dm2
Recommended polishing lap: Polyurethane
Recommended polishing speed: not less than
500 rpm
No suspension agents are added so agitation of the slurry is recommended. Suspension
agents can be recommended for particular applications.